dim 250plm33 - ts000 igbt chopper module replaces ds6108 - 2 ds 6108 - 3 september 201 4 (ln 31958 ) caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures 1 / 8 www.dynexsemi.com features ? 10s short circuit withstand ? high thermal cycling capability ? high current density enhanced dmos spt ? isolated alsic base with aln substrates applications ? choppers ? motor controllers ? power supplies ? traction auxiliaries the powerline range of high power modules includes half bridge, chopper, dual, single and bi - directional switch configurations covering voltages from 1200v to 6500v and currents up to 2400a. the dim 25 0plm33 - t s 000 is a 33 00v, n - channel enhancement mode, insulated gate bipolar transistor (igbt) chopper module configured with the lower arm of the bridge controlled. the igbt has a wide reverse bias safe operating area (rbsoa) . this device is optimised for traction drives and other applications requiring high thermal cycli ng capability. the module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety . ordering information order as: dim 25 0plm33 - t s 000 note: when ordering, please use the complete part number key parameters v ces 33 00v v ce(sat) * (typ) 2.2 v i c (max) 25 0 a i c(pk) (max) 5 0 0 a * m e asured at the auxiliary terminals fig. 1 circuit configuration outline type cod e: p (see fig. 11 for further information) fig. 2 package 6(g 2 ) 7(e 2 ) 3(e2) 8(c 2 ) 2(k) 1(a/c2)
dim250plm33 - ts000 2 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com absolute maximum ratings stresses above those listed under absolute maximum ratings may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. appropriate safety precautions should always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25c unless stated otherwise symbol parameter test conditions max. units v ces collector - emitter voltage v ge = 0v 33 00 v v ges gate - emitter voltage 20 v i c continuous collector current t case = 110 c 25 0 a i c(pk) peak collector current 1ms, t case = 14 0 c 5 00 a p max max. transistor power dissipation t case = 25 c , t j = 150 c 2.6 k w i 2 t diode i 2 t value C igbt arm v r = 0, t p = 10ms, t j = 150 oc 20 ka 2 s diode i 2 t value C diode arm 20 ka 2 s v isol isolation voltage C per module commoned terminals to base plate. ac rms, 1 min, 50hz 6000 v q pd partial discharge C per module iec1287, v 1 = 35 00v, v 2 = 26 00v, 50hz rms 10 pc thermal and mechanical ratings internal insulation material: aln baseplate material: alsic creepage distance: 33 mm clearance: 20 mm cti (comparative tracking index): >600 symbol parameter test conditions min typ. max units r th(j - c) thermal resistance C th(j - c) thermal resistance C C th(c - h) thermal resistance C j junction temperature transistor - - 150 c diode - - 150 c t stg storage temperature range - - 40 - 125 c screw torque mounting C C
dim250plm33 - ts000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures 3 / 8 www.dynexsemi.com electrical characteristics t case = 25 c unless stated otherwise. symbol parameter test conditions min typ max units i ces collector cut - off current v ge = 0v, v ce = v ces 1 ma v ge = 0v, v ce = v ces , t case = 125c 15 ma v ge = 0v, v ce = v ces , t case = 150c 25 ma i ges gate leakage current v ge = 20v, v ce = 0v 1 a v ge(th) gate threshold voltage i c = 4 0 ma, v ge = v ce 5.7 v v ce(sat) ? collector - emitter saturation voltage v ge = 15v, i c = 250a 2.2 v v ge = 15v, i c = 250a, t j = 125c 2.8 v v ge = 15v, i c = 250a, t j = 150c 3.0 v i f diode forward current dc 2 5 0 a i fm diode maximum forward current t p = 1ms 5 00 a v f diode forward voltage ? (igbt arm) i f = 250a 2.4 v diode forward voltage ? (diode arm) 2.5 v diode forward voltage ? (igbt arm) i f = 250a, t j = 125c 2. 5 v diode forward voltage ? (diode arm) 2. 6 v diode forward voltage ? (igbt arm) i f = 250a, t j = 150c 2.4 v diode forward voltage ? (diode arm) 2.5 v c ies input capacitance v ce = 25v, v ge = 0v, f = 1mhz 45 nf q g gate charge 15v including external c ge 5 c c res reverse transfer capacitance v ce = 25v, v ge = 0v, f = 1mhz 1 nf l m module inductance 40 nh r int internal transistor resistance 500 ? sc data short circuit current, i sc t j = 150 c, v cc = 25 00v t p 10s, v ge 15v v ce (max) = v ces C l * x di/dt iec 60747 - 9 950 a note: ? measured at the auxiliary terminals ? measured at the power busbars * l is the circuit inductance + l m
dim250plm33 - ts000 4 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com electrical characteristics t case = 25c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 25 0a v ge = 15v v ce = 1800v r g (on) = 10 ? r g (off) = 10 ? c ge = 56 nf l s ~ 15 0nh 2700 ns t f fall time 520 ns e off turn - off energy loss 480 mj t d(on) turn - on delay time 1000 ns t r rise time 400 ns e on turn - on energy loss 320 mj q rr diode reverse recovery charge i f = 25 0a v ce = 1800v di f /dt = 70 0 a/s 180 c i rr diode reverse recovery current 160 a e rec diode reverse recovery energy 165 mj t case = 125c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 25 0a v ge = 15v v ce = 1800v r g (on) = 10 ? r g (off) = 10 ? c ge = 56 nf l s ~ 15 0nh 2750 ns t f fall time 570 ns e off turn - off energy loss 540 mj t d(on) turn - on delay time 1020 ns t r rise time 420 ns e on turn - on energy loss 420 mj q rr diode reverse recovery charge i f = 25 0a v ce = 1800v di f /dt = 70 0 a/s 230 c i rr diode reverse recovery current 200 a e rec diode reverse recovery energy 280 mj t case = 15 0 c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 25 0a v ge = 15v v ce = 1800v r g (on) = 10 ? r g (off) = 10 ? c ge = 56 nf l s ~ 15 0nh 2800 ns t f fall time 550 ns e off turn - off energy loss 580 mj t d(on) turn - on delay time 1030 ns t r rise time 430 ns e on turn - on energy loss 460 mj q rr diode reverse recovery charge i f = 25 0a v ce = 1800v di f /dt = 70 0 a/s 270 c i rr diode reverse recovery current 200 a e rec diode reverse recovery energy 330 mj
dim250plm33 - ts000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures 5 / 8 www.dynexsemi.com fig. 3 typical output characteristics fig. 4 typical output characteristics fig. 5 typical switching energy vs collector current fig. 6 typical switching energy vs gate resistance
dim250plm33 - ts000 6 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com fig. 7 diode typical forward characteristics fig. 8 reverse bias safe operating area fig. 9 diode reverse bias safe operating area fig. 10 transient thermal impedance
dim250plm33 - ts000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures 7 / 8 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated otherwise. do not scale. nominal weight: 50 0 g module outline type code: p fig. 11 module outline drawing
dim250plm33 - ts000 8 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com important information: this publication is provided for information only and not for resale. the products and information in this publication are intended for use by appropriately trained technical personnel. due to the diversity of product applications, the information contained herein is provided as a general guide only and does n ot constitute any guarantee of suitability for use in a specific application . the user must evaluate the suitability of the product and the completeness of the product data for the application. the user is responsible for product selection and ensuring all safety and any warning requirements are met. should additional product information be needed plea se contact customer service. although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. the information is provided without any warranty or guarantee of any kind. this publi cation is an uncontrolled document and is subject to change without notice. when referring to it please ensure that it is the most up to date version and has not been superseded. the products are not intended for use in applications where a failure or ma lfunction may cause loss of life, injury or damage to property. the user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. the products must not be touched when operatin g because there is a danger of electrocution or severe burning. always use protective safety equipment such as appropriate shields for the product and wear safety glasses. even when disconnected any electric charge remaining in the product must be discha rged and allowed to cool before safe handling using protective gloves. extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. use outside the product ratings is likely to cause permanent d amage to the product. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. appropriate application design and safety precautions should always be followed to protect persons and property. product status & product ordering: we annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully appr oved for production. the annotations are as follows: - target information: this is the most tentative form of information and represents a very preliminary specification. no actual design work on the product has been started. preliminary information: the product design is complete and final characterisation for vo lume production is in progress. the datasheet represents the product as it is now understood but details may change. no annotation: the product has been approved for production and unless otherwise notified by dy nex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. all products and materials are sold and services provided subject to dynexs conditions of sale, which are availab le on request. any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. headquarters operations customer service dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom fax: +44(0)1522 500550 fax: +44(0)1522 500020 tel: +44(0)1522 500500 tel: +44(0)1522 502753 / 502901 web: http://www.dynexsemi.com email: power_solutions@dynexsemi.com ? dynex semiconductor ltd. 2013 technical documentation C not for resale.
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